Adhesion promoters coupling agents for 2K epoxy Adhesive & Sealant

Kabasph series of additives are specifically developed for two-component epoxy systems and are suitable for applications such as two-component epoxy adhesives, sealants, potting compounds, electronic encapsulation, composites, industrial flooring, civil engineering, and high-performance protective systems. The product range covers five major categories—dispersants, anti-sinking thixotropic agents, wetting and levelling agents, defoamers, and tackifiers—providing a comprehensive additive solution for two-component epoxy formulations. It addresses key challenges including filler and nano-filler dispersion, viscosity reduction at high filler loading, anti-settling and sag control, wetting on oily substrates, levelling, foam control, and adhesion to metal and non-metal surfaces, while maintaining storage stability, curing activity, colour stability, and final film or bond performance.