silicone-free defoamer for epoxy adhesive Sealants

This series of additives are specifically developed for one-component epoxy adhesives and are suitable for applications such as one-component epoxy adhesives, sealants, potting compounds, electronic encapsulation, composites, and high-performance industrial systems. The product range covers five major categories—dispersants, anti-sinking thixotropic agents, wetting and levelling agents, defoamers, and tackifiers—providing a comprehensive additive solution for one-component epoxy formulations. It addresses key challenges including filler dispersion, viscosity reduction at high filler loading, anti-settling and sag control, wetting on difficult substrates, levelling, foam control, and adhesion to metal and non-metal surfaces, while maintaining storage stability, curing activity, and final film or bond performance.