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Two-component epoxy systems are widely used in adhesives, sealants, potting, electronic encapsulation, composites, industrial flooring, civil engineering, and protective applications where high mechanical strength, chemical resistance, and durable adhesion are essential. However, formulating with these systems presents unique challenges: filler and nano-filler dispersion, viscosity control at high filler loading, settling and sagging, wetting on oily or contaminated substrates, levelling, foam generation, colour stability in anhydride-cured systems, compatibility with amine curing agents, and adhesion failure on metal and non-metal surfaces. Additives must be carefully selected to maintain compatibility with both the epoxy resin and the curing agent without adversely affecting curing speed, pot life, storage stability, transparency, colour, or final film properties.
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Two-component Epoxy System |
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Application Classification |
Model |
Product Type |
Product Characteristics |
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Dispersant |
KBS-F5000A |
Acid polyester compounds |
General-purpose cost-effective viscosity reducing dispersant |
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KBS-F9100 |
Acid polyester compounds |
Highly efficient viscosity reduction with high fillers |
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KBS-F9100A |
Acid polyester compounds |
Strong viscosity reduction with high fillers, especially suitable for viscosity reduction of thermally conductive fillers |
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KBS-F0400 |
Modified polyester polymers |
Dispersion of nano inorganic fillers with excellent stability |
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KBS-F8600 |
Acid polyester compounds |
High filler strength, excellent stability, colour stability in anhydride cured systems |
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Anti-sinking Thixotropic Agent |
KBS-C410K |
Organic polyurea |
Low impact on transparency, viscosity, storage stability and curing activity, excellent anti-sinking and thixotropic effect. |
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KBS-C6100 |
Modified polyamide solutions |
With hydrophilic aerosilicone, improve the thixotropy of epoxy system, does not affect the viscosity of amine curing agent. |
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KBS-C6200 |
Modified polyamide solutions |
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KBS-C3120X |
Polyamide wax pastes |
Environmentally friendly solvents have excellent anti-sinking and thixotropic effects on high specific gravity fillers, and their unique molecular structure is helpful for bond strength enhancement. |
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